ECE 6244: Design and Process Integration for Wide Band Gap Power Devices
Ohio State University
Design and processing of wide band gap power devices (including SiC, GaN and ultra wide band gap semiconductors) and reliability considerations. 2D device simulations, layout considerations for power chip from 600 V to 15 kV. Prereq: Grad standing in Engineering or Physics. Not open to students with credit for 6234.
Average GPA: 3.84
Grade distribution records: 53 students across 3 terms.
Grade distribution
| Grade | Students | Percent |
|---|---|---|
| A | 42 | 79.2% |
| A- | 6 | 11.3% |
| B | 1 | 1.9% |
| B- | 3 | 5.7% |
| C | 1 | 1.9% |
Based on 53 student grade records across 3 terms.