ECE 225: Bandgap Engineering
University of California, Santa Cruz
Addresses principles of semiconductor processing with applications for semiconductor materials engineering, research, and development. The materials fabrication and processing topics include preparation of silicon, III-V compounds, and dielectric thin films, including thin film deposition techniques, diffusion, ion implantation, and standard device fabrication sequences. Applications of these processing principles for semiconductor materials engineering and bandgap engineering in semiconductor heterostructures are discussed for devices, such as LEDs, lasers, photoreceptors, modulators, and high-speed transistors.
Average GPA: 3.83
Grade distribution records: 39 students across 2 terms.
Grade distribution
| Grade | Students | Percent |
|---|---|---|
| A+ | 1 | 2.6% |
| A | 17 | 43.6% |
| A- | 2 | 5.1% |
| B+ | 2 | 5.1% |
| C | 1 | 2.6% |
| P | 1 | 2.6% |
| S | 14 | 35.9% |
| U | 1 | 2.6% |
Based on 39 student grade records across 2 terms and 1 professor.
Instructors
- Michael M Oye 39 students, Average GPA 3.83