ECE 225

Bandgap Engineering

5credits
About this course

Addresses principles of semiconductor processing with applications for semiconductor materials engineering, research, and development. The materials fabrication and processing topics include preparation of silicon, III-V compounds, and dielectric thin films, including thin film deposition techniques, diffusion, ion implantation, and standard device fabrication sequences. Applications of these processing principles for semiconductor materials engineering and bandgap engineering in semiconductor heterostructures are discussed for devices, such as LEDs, lasers, photoreceptors, modulators, and high-speed transistors.

All available terms

2 terms

Avg. GPA
3.83
Grades
39

Other grades

P2.6%S35.9%U2.6%
More course details

University of California, Santa Cruz

ECE 225 at UCSC: average GPA 3.83 across 39 students. Grade distribution by term. Addresses principles of semiconductor processing with applications for…

Average GPA: 3.83

Grade distribution records: 39 students across 2 terms.

Grade distribution

GradeStudentsPercent
A+12.6%
A1743.6%
A-25.1%
B+25.1%
C12.6%
P12.6%
S1435.9%
U12.6%

Based on 39 student grade records across 2 terms and 1 professor.

Instructors

The course page is taking longer to load. This summary is still available.

We could not load the full course details. This summary is still available.

Still loading. This can take a moment on a slow connection.

Loading My Class Grades